Bracket assembly for a multi-component vision system in an electronic device

ABSTRACT

An electronic device that includes a vision system carried by a bracket assembly is disclosed. The vision system may include a first camera module that captures an image of an object, a light emitting element that emits light rays toward the object, and a second camera module that receives light rays reflected from the object. The light rays may include infrared light rays. The bracket assembly is designed not only carry the aforementioned modules, but to also maintain a predetermined and fixed separation between the modules. The bracket assembly may form a rigid, multi-piece bracket assembly to prevent bending, thereby maintaining the predetermined separation. The electronic device may include a transparent cover designed to couple with a housing. The transparent cover incudes an alignment module designed to engage a module and provide a moving force that aligns the bracket assembly and the modules to a desired location in the housing.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/269,507, filed on Feb. 6, 2019, entitled “BRACKET ASSEMBLY FOR AMULTI-COMPONENT VISION SYSTEM IN AN ELECTRONIC DEVICE,” which is acontinuation of U.S. patent application Ser. No. 15/914,947, filed onMar. 7, 2018, entitled “BRACKET ASSEMBLY FOR A MULTI-COMPONENT VISIONSYSTEM IN AN ELECTRONIC DEVICE,” now U.S. Pat. No. 10,268,234, issued onApr. 23, 2019, which claims the benefit of priority to U.S. ProvisionalApplication No. 62/542,277, filed on Aug. 7, 2017, entitled “BRACKETASSEMBLY FOR A MULTI-COMPONENT VISION SYSTEM IN AN ELECTRONIC DEVICE,”and U.S. Provisional Application No. 62/542,280, filed on Aug. 7, 2017,entitled “ELECTRONIC DEVICE HAVING A VISION SYSTEM ASSEMBLY HELD BY ASELF-ALIGNING BRACKET ASSEMBLY,” the disclosures of which areincorporated herein by reference in their entirety.

FIELD

The following description relates to an electronic device. Inparticular, the following description relates to an electronic devicethat includes a bracket assembly designed to carry a vision system usedto develop a depth map of an image captured by a camera module of thevision system, with the depth map representing a three-dimensionalcounterpart of the image. The bracket assembly maintains the modules ofthe vision system at a predetermined distance from each other. In orderto properly align the vision system in the electronic device, theelectronic device includes a transparent cover that includes analignment module. During assembly between the transparent cover and anenclosure (or housing) of the electronic device, the alignment module isdesigned to engage at least one of the modules held by the bracketassembly to align the vision system in accordance with a desiredlocation in the enclosure.

BACKGROUND

An emitter and receiver pair can be used to determine dimensionalinformation. The emitter can radiate light onto an object. The lightreflected from the object is directed toward, and collected by, thereceiver. In some instances, the emitter-receiver pair is placed in anelectronic device. As a result, the emitter-receiver pair may be subjectto external forces exerted on the electronic device and transmitted tothe emitter-receiver pair. In instances where the emitter-receiver pairis calibrated and subsequently relies upon a spatial relationshipbetween the emitter and the receiver, any relative shifting, ormovement, of one of the components (that is, the receiver or theemitter) causes the emitter-receiver pair to fall out of calibration,thereby causing the emitter-receiver pair to erroneously determine thedimensional information of the object. As a result, the electronicdevice may not function properly.

SUMMARY

In one aspect, a portable electronic device is described. The portableelectronic device may include a bottom wall and sidewalls that, incooperation with the bottom wall, define a cavity. The sidewalls mayinclude edges that define an opening that leads into the cavity. Theportable electronic device may further include a protective layer thatcovers the opening and encloses the cavity. The protective layer mayinclude an internal surface that faces the bottom wall. The portableelectronic device may further include a vision subsystem positionedwithin the cavity and between the protective layer and the bottom walland operable to provide a depth map of an object external to theprotective layer. The vision may include a bracket assembly arranged tocarry optical components that cooperate to provide information used tocreate the depth map. The bracket assembly may include a first bracketarranged to carry and maintain the optical components at a fixeddistance from each other. The bracket assembly may further include asecond bracket having a body secured with the first bracket. The secondbracket may include a protrusion that extends away from the body. Theportable electronic device may further include an alignment modulesecured to the internal surface. The alignment module may includealignment structures associated and aligned with corresponding opticalcomponents. In some embodiments, the protrusion engages the bottom wallsuch that the bracket assembly is biased towards the alignment module.

In another aspect, an electronic device is described. The electronicdevice may include an enclosure that defines an internal volume. Theelectronic device may further include a vision subsystem positioned inthe internal volume. The vision subsystem may provide object recognitionof an object that is external to the enclosure. The vision subsystem mayinclude a camera module and a light emitting module. The electronicdevice may further include a bracket assembly that holds the visionsubsystem. The bracket assembly may be supported by the enclosure andfree of affixation to the enclosure. In some embodiments, the bracketassembly maintains a predetermined distance between the camera moduleand the light emitting module.

In another aspect, an electronic device is described. The electronicdevice may include an enclosure that includes a bottom wall and sidewallcomponents that combine with the bottom wall to define an internalvolume. The electronic device may further include a transparent coversecured with the enclosure. The electronic device may further include abracket assembly disposed in the internal volume and carrying a visionsystem that includes operational components for facial recognition. Thebracket assembly may include a first bracket and a second bracket thatsecures to the first bracket. In some embodiments, the bracket assemblymaintains a predetermined distance between the operational components.Also, in some embodiments, movement of the bracket assembly relative tothe enclosure causes a corresponding movement of the operationalcomponents such that the predetermined distance is maintained.

In another aspect, a portable electronic device is described. Theportable electronic device may include a bottom wall and sidewalls that,in cooperation with the bottom wall, define a cavity. The sidewalls maydefine an opening that leads into the cavity. The portable electronicdevice may further include an optically clear protective layer thatcovers the opening and encloses the cavity. The portable electronicdevice may further include a vision subsystem operable to provide animage characteristic of an object located in front of the opticallyclear protective layer. The vision subsystem may include a bracket thatis arranged to carry, on a first side facing an interior surface of theoptically clear protective layer, optical components located at fixeddistances from each other. Some of the optical components may cooperateto provide information used to generate the image characteristic. Thevision subsystem may further include a biasing element that (i) engagesa second side of the bracket that is facing away from the interiorsurface of the optically clear protective layer and that (ii) engages aninterior surface of the bottom wall. In some embodiments, the biasingelement biases the bracket away from the interior surface of the bottomwall and towards the interior surface of the optically clear protectivelayer such that the bracket is free to move within the cavity withrespect to, at least, the bottom and sidewalls while the fixed distancesbetween the optical components remain unchanged.

Other systems, methods, features and advantages of the embodiments willbe, or will become, apparent to one of ordinary skill in the art uponexamination of the following figures and detailed description. It isintended that all such additional systems, methods, features andadvantages be included within this description and this summary, bewithin the scope of the embodiments, and be protected by the followingclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 illustrates a front isometric view of an embodiment of a systemthat includes a vision system and a bracket assembly designed to carrythe vision system, in accordance with some described embodiments;

FIG. 2 illustrates a rear isometric view of the system shown in FIG. 1,showing additional features of the bracket assembly;

FIG. 3 illustrates an exploded view of the system shown in FIGS. 1 and2, showing the bracket assembly, the modules and additional features;

FIG. 4 illustrates an exploded view of an alternate embodiment of afirst bracket, showing the first bracket formed from several structuralcomponents, in accordance with some described embodiments;

FIG. 5 illustrates a rear view of an alternate embodiment of a secondbracket, in accordance with some described embodiments;

FIG. 6 illustrates a plan view of an embodiment of a vision systempositioned in a bracket assembly, showing the bracket assemblymaintaining spatial relationships between the modules, in accordancewith some described embodiments;

FIG. 7 illustrates an isometric view of an embodiment of a lightemitting module, in accordance with some described embodiments;

FIG. 8 illustrates a side view of the light emitting module shown inFIG. 7, further showing additional features of the light emittingmodule;

FIG. 9 illustrates an isometric view of an embodiment of an alignmentmodule, in accordance with some described embodiments;

FIG. 10 illustrates a side view of the lighting element shown in FIG. 9,showing additional features of the lighting element;

FIG. 11 illustrates a side view of an alignment module positioned over abracket assembly and a vision system positioned in the bracket assembly,prior to an assembly operation;

FIG. 12 illustrates a side view of the alignment module, the visionsystem, and the bracket assembly shown in FIG. 11, further showing thealignment module and several modules and components in relation to thealignment module, in accordance with some described embodiments;

FIG. 13 illustrates a plan view of an embodiment of an electronicdevice, in accordance with some described embodiments;

FIG. 14 illustrates a cross sectional view taken along line A-A in FIG.13, showing a location of the transparent cover, the masking layersecured with the transparent cover, and several layers of materialsecured with the transparent cover, in accordance with some describedembodiments;

FIG. 15 illustrates a cross sectional view taken along line B-B in FIG.13, showing a different location of the transparent cover and a materialpositioned in an opening of the masking layer;

FIG. 16 illustrates a cross sectional view of the electronic devicetaken along line C-C in FIG. 13, showing various layers of the displayassembly;

FIG. 17 illustrates a plan view of the electronic device shown in FIG.13, with the transparent cover and the display assembly removed;

FIG. 18 illustrates a plan view of the transparent cover shown in FIG.13, further showing an alignment module secured with the transparentcover;

FIG. 19 illustrates a cross sectional view of the transparent cover andthe alignment module secured with the transparent cover, further showingan audio module, a microphone, and a lighting element;

FIG. 20 illustrates a cross sectional view of an alternate embodiment ofa transparent cover and an alignment module secured with the transparentcover, further showing an audio module that is modified to secure to thetransparent cover;

FIG. 21 illustrates a cross sectional view partially showing theelectronic device shown in FIG. 13, showing an assembly operationbetween the transparent cover and the enclosure, in accordance with somedescribed embodiments;

FIG. 22 illustrates a cross sectional view of the electronic deviceshown in FIG. 21, further showing the transparent cover being loweredtoward the enclosure;

FIG. 23 illustrates a cross sectional view of the electronic deviceshown in FIG. 22, with the transparent cover secured with the enclosure;

FIG. 24 illustrates an alternate cross sectional view of the electronicdevice shown in FIGS. 21-23, showing the positioning of some of thecomponents within the electronic device, in accordance with somedescribed embodiments;

FIG. 25 illustrates a plan view of a dot pattern generated by a lightsource, in accordance with some described embodiments;

FIG. 26 illustrates a side view of an electronic device using a visionsystem to determine dimensional information of a user, in accordancewith some described embodiments;

FIG. 27 illustrates a plan view of a dot pattern projected onto theuser, showing various spatial relationships of dots of the dot patternwith respect to each other;

FIG. 28 illustrates a schematic diagram of an electronic device, inaccordance with some described embodiments;

FIG. 29 illustrates a plan view of an alternate embodiment of anelectronic device that includes a vision system held by a bracketassembly, in accordance with some described embodiments;

FIG. 30 illustrates a plan view of an alternate embodiment of anelectronic device that includes a vision system held by a bracketassembly, in accordance with some described embodiments; and

FIG. 31 illustrates a flowchart describing a method for assembling avision system for recognition of an object, in accordance with somedescribed embodiments.

Those skilled in the art will appreciate and understand that, accordingto common practice, various features of the drawings discussed below arenot necessarily drawn to scale, and that dimensions of various featuresand elements of the drawings may be expanded or reduced to more clearlyillustrate the embodiments of the present invention described herein.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

In the following detailed description, references are made to theaccompanying drawings, which form a part of the description and in whichare shown, by way of illustration, specific embodiments in accordancewith the described embodiments. Although these embodiments are describedin sufficient detail to enable one skilled in the art to practice thedescribed embodiments, it is understood that these examples are notlimiting such that other embodiments may be used, and changes may bemade without departing from the spirit and scope of the describedembodiments.

The following disclosure relates to an electronic device that includes avision system designed to assist in providing recognition of an object,or objects. In some instances, the vision system is designed to providefacial recognition of a face of a user of the electronic device. Thevision system may include a camera module designed to capture an image,which may include a two-dimensional image. The vision system may furtherinclude a light emitting module designed to emit several light raystoward the object. The light rays may project a dot pattern onto theobject. Further, the light emitting module may emit light in thefrequency spectrum of invisible light, such as infrared light (or IRlight). The vision system may further include an additional cameramodule designed to receive at least some of the light rays reflectedfrom the object, and as a result, receive the dot pattern subsequent tothe light rays being reflected by the object. The additional cameramodule may include a light filter designed to filter out light in thatis not within the frequency spectrum of light emitted from the lightemitting module. As an example, the light filter may include an IR lightfilter designed to block light that is outside the frequency range forIR light. The additional camera module may provide the dot pattern (or atwo-dimensional image of the dot pattern) to a processor in theelectronic device.

The light emitting module is designed to emit light rays such that whenthe object is flat (resembling a two-dimensional object), the projecteddot pattern resembles a “uniform” dot pattern in which the dots areequally spaced apart in rows and columns. However, when the objectincludes a three-dimensional object (such as a face), the projected dotpattern may include a “non-uniform” dot pattern in which a separationdistance between some adjacent dots differs from a separate distance ofother adjacent dots. The variation in separation distances betweenadjacent dots corresponds some structural features of the object beingcloser to the light emitting module (and in particular, closer to theelectronic device) as compared to other structural features. Forexample, adjacent dots projected onto relatively closer structuralfeatures of the object may be separated by a distance that is less thanthat of structural features of the object that are relatively furtheraway. The relative separation distances of adjacent dots, along with atwo-dimensional image of the object, may be used by the processordetermine a third, additional dimension of the object such that athree-dimensional profile of the object is created. As a result, thevision system may assist in providing a three-dimensional representationof the object.

The vision system may be installed in the electronic device using abracket assembly. The bracket assembly may include one or more bracketsub-assemblies, with a bracket sub-assembly including one or morebracket components. Once the camera modules and the light emittingmodule are installed in the bracket assembly, the bracket assembly isdesigned to maintain a fixed distance between the aforementionedmodules. This includes instances when an external force is exerted onthe electronic device (that carries the vision system and the bracketassembly), such as when the electronic device is dropped. When thisoccurs, the modules and the bracket assembly may shift relative to othercomponents of the electronic device. However, the bracket assembly isdesigned to prevent or substantially limit relative movement of themodules with respect to each other. When modules are installed andrelative movement of the modules is prevented or substantially limited,the modules may continue to accurately provide the aforementionedthree-dimensional object recognition without re-calibration. Also, inorder to provide stiffness and rigidity to prevent bending, the bracketassembly may include multiple bracket components welded and/oradhesively secured together, and may include multiple bends and inclinedsections.

In order to facilitate the assembly process over traditional processes,the bracket assembly—subsequent to placement into an enclosure, orhousing, of the electronic device—may not be mechanically fastened oraffixed to the enclosure (although electrical connections may beestablished between the modules carried by the bracket assembly and acomponent(s) disposed in the enclosure). In order to align the bracketassembly in the enclosure in a desired manner, the electronic device mayinclude an alignment module secured with a transparent cover (such as acover glass). The alignment module may include multiple openings, eachof which is designed to receive a module of the vision system. During anassembly operation while the transparent cover is assembled with theenclosure, the alignment module is designed to engage at least one ofthe modules. The engagement provides a force that adjusts or moves thebracket assembly, relative to the enclosure, to a desired location inthe enclosure (or within an internal volume defined by the enclosure).The adjustment/movement may include movement in one or more dimensions(of a Cartesian coordinate system). Accordingly, the bracket assemblymay be referred to as a “self-aligning bracket assembly” due to itsability to move about the enclosure and become aligned by the alignmentmodule without any prefixing or pre-fastening of the bracket assembly.

In order to enhance the appearance, the electronic device may includemasking layers designed to hide, or at least partially hide, the modulesand the bracket assembly. As an example, the electronic device mayinclude a transparent cover that includes various layers of ink. Someink layers applied to the transparent cover include an opaque materialthat generally hides the modules and the bracket assembly, while otherlayers applied to the transparent cover include an appearance thatmatches (in terms of color) the appearance of the opaque material.However, these other layers may be designed to allow light, in the formof IR light or visible light, to pass. These light permissive layers maybe located in openings of the opaque material. As a result, the cameramodule used to capture an image may be covered by an ink layer may thatpermits visible light to pass, while the light emitting module and theadditional camera module may each be covered by an ink layer may thatpermits IR light to pass.

The alignment module can be adhered to the transparent cover in a mannerthat aligns openings of the alignment modules with some of the openingsof the opaque material that are filled by light permissive layers. Whenthe transparent cover is assembled with the enclosure, the modules arealigned with some of the openings of the alignment module. To limit orprevent movement of the bracket assembly, the bracket assembly mayinclude flexible spring elements that support the bracket assembly. Thespring elements are designed to flex or bend in response to compressionforces from the transparent cover and the enclosure. In response, thespring elements may provide a counterforce that biases the bracketassembly (and the modules carried by the bracket assembly) in adirection toward the transparent cover, thereby increasing an engagementforce between the bracket assembly and the alignment module. Theincreased engagement force may further maintain the bracket assembly ina fixed position and prevent unwanted movement of the bracket assembly(and the modules carried by the bracket assembly). Moreover, when thebracket assembly is formed from a metal, the bracket assembly mayprovide an electrical grounding path for the modules as the springelement may engage an electrical grounding material within the internalvolume defined by the enclosure. For example, the enclosure may includea metal layer in contact with the spring elements. To further assist inelectrical grounding, the modules may be adhered to the bracket assemblyby an electrically conductive adhesive.

Traditional assembly processes may pre-fasten the bracket assembly andits components into a housing of the electronic device, followed byattaching the transparent cover to the housing. The traditional assemblyprocesses may also include bracket assemblies and transparent coverssorted in bins, in which a bin may include bracket assemblies that fallinto one of several predetermined ranges (of size), and another bin thatmay include transparent covers (with applied ink layers) that fall intoone of several sizes that pair with a bracket assembly in with a givenrange. However, the electronic devices described herein include inklayers applied to the transparent cover without predetermining thespecific bracket assembly and modules to be used with the electronicdevice, as the modules carried by the can be properly aligned with theirrespective ink layers with the assistance of the alignment module.

These and other embodiments are discussed below with reference to FIGS.1-31. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these Figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 illustrates a front isometric view of an embodiment of a system100 that includes a vision system 110, or vision subsystem, and abracket assembly 140 designed to carry the vision system 110, inaccordance with some described embodiments. As shown, the vision system110 may include several operational components (including opticalcomponents), with each operational component providing a specificfunction. For example, the vision system 110 may include a first cameramodule 112, a light emitting module 114, and a second camera module 116.The first camera module 112, or first operational component, is designedto capture an image of an object (not shown). The light emitting module114, or second operational component, is designed to emit light, in theform of multiple light rays, in a direction toward the object.Accordingly, the light emitting module 114 may be referred to as a lightemitter. In some instances, the light emitting module 114 emits lightthat is not visible by the human eye. For example, the light emittingmodule 114 may emit IR light. The second camera module 116, or thirdoperational component, is designed to receive at least some of the lightrays that are emitted from the light emitting module 114, subsequent tothe light rays reflecting from the object. Accordingly, the secondcamera module 116 may be referred to as a light receiver. Also, thesecond camera module 116 may include a filter designed to filter outother types of light outside the frequency range of the light raysemitted from the light emitting module 114. As an example, the filter(located within the second camera module 116 or over a lens of thesecond camera module 116) may permit only IR light emitted from thelight emitting module 114 to enter the second camera module 116.

The vision system 110 is designed to assist in object recognition. Inthis regard, the vision system 110 may use the first camera module 112to generate a two-dimensional image of the object. In order to determinespatial relationships between various features of the object, the lightrays emitted from the light emitting module 114 may project a dotpattern onto the object (or objects). When the light generated from thelight emitting module 114 is reflected from the object, the secondcamera module 116 captures the reflected light to create an image of theprojected dot pattern on the object. The projected dot pattern can beused to form a depth map of the object, with the depth map correspondingto a three-dimensional counterpart of the object. The combination of theimage (taken by the first camera module 112) and the dot pattern (takenby the second camera module 116) projected onto the image can be used todevelop a three-dimensional profile of the object. In this regard, whenthe vision system 110 is in an electronic device (not shown), the visionsystem 110 can assist the electronic device in providing a facialrecognition of a face of a user of the electronic device. This will befurther discussed below.

The bracket assembly 140 may include a first bracket 142 coupled to asecond bracket 144. The coupling may include welding, adhering,fastening, clipping, or the like. The first bracket 142 and the secondbracket 144 may include a rigid material, such as steel or aluminum.However, other materials, such as plastic (including a molded plastic),are possible. In order for the vision system 110 to provide accurateobject recognition, the space or distance between the modules shouldremain constant, or at least substantially constant. In other words, anyrelative movement of a module of the vision system 110 with respect tothe remaining modules should be prevented or substantially limited. Thebracket assembly 140 is designed to provide a rigid system that housesthe modules and also prevents relative movement of any module withrespect to the remaining modules. Further, when the vision system 110and the bracket assembly 140 are positioned in an electronic device,external forces exerted on the electronic device (such as a drop of theelectronic device against a structure) may cause the vision system 110and the bracket assembly 140 to move or shift in the electronic device.However, any movement of bracket assembly 140 may correspond to an equalamount of movement of each of the modules of the vision system 110 suchthat relative movement of the modules of the vision system 110 isprevented. Moreover, in some instances, the bracket assembly 140 is notheld or affixed to an enclosure of the electronic device by fasteners,adhesives, clips, or other rigid fixture-type structures. This will befurther discussed below.

Each of the modules of the vision system 110 may include a flexiblecircuit, or flex connector, designed to electrically couple a module toa circuit board (not shown) to place the vision system 110 in electricalcommunication with one or more processor circuits (not shown) positionedon the circuit board. For example, the first camera module 112, thelight emitting module 114, and the second camera module 116 may includea first flexible circuit 122, a second flexible circuit 124, and a thirdflexible circuit 126, respectively, with each of the flexible circuits,or flex connectors, extending from their respective modules and out ofbracket assembly 140. Also, as shown, the first flexible circuit 122 mayoverlap the second flexible circuit 124 in order to align the flexiblecircuits in a desired manner.

FIG. 2 illustrates a rear isometric view of the system 100 shown in FIG.1, showing additional features of the bracket assembly 140. As shown,the second bracket 144 may include spring elements, such as a firstspring element 146 and a second spring element 148, that extend from asurface of the second bracket 144. When the bracket assembly 140 ispositioned in an electronic device (not shown), the spring elements mayengage an enclosure (or some other structural feature in the enclosure)of the electronic device and support the bracket assembly 140 and themodules. Further, the spring elements may act as biasing elements thatbias the bracket assembly 140 in a direction away from the enclosure.For instance, when a transparent cover (such as a cover glass) issecured with the enclosure, the transparent cover and/or the enclosuremay apply compression forces on the bracket assembly 140, causingbending or flexing of the first spring element 146 and the second springelement 148. However, the first spring element 146 and the second springelement 148 are designed to provide a counterforce that biases thebracket assembly 140 toward the transparent cover and against analignment module (discuss later), thereby providing a securing force forthe bracket assembly 140 (and the vision system 110). This will befurther shown below. Also, in some instances, a cutting operation usedto cut the second bracket 144 to form the first spring element 146 andthe second spring element 148 may cut only a portion of the secondbracket 144 such that the second bracket 144 does not include throughholes, or openings, in locations corresponding to the first springelement 146 and the second spring element 148. As a result, the secondbracket 144 maintains a continuous, uninterrupted support layer for themodules in location corresponding to the first spring element 146 andthe second spring element 148.

In order to electrically couple the modules to a circuit board, theflexible circuits may include connectors. For example, the firstflexible circuit 122, the second flexible circuit 124, and the thirdflexible circuit 126 may include a first connector 132, a secondconnector 134, and a third connector 136, respectively. Also, the secondbracket 144 may include a through hole 152, or opening, in a locationcorresponding to the light emitting module 114 (shown in FIG. 1). Thisallows for a heat sinking element (not shown) to pass through thethrough hole 152 and thermally couple to the light emitting module 114in order to dissipate heat from the light emitting module 114 andprevent overheating during use.

FIGS. 1 and 2 show a system 100 that is fully assembled with the visionsystem 110 carried by the bracket assembly 140. In other words, thefirst bracket 142 and the second bracket 144 can combine to receive andsecure the first camera module 112, the light emitting module 114, andthe second camera module 116. In this regard, the aforementioned modulesmay enhance or increase the overall rigidity of the system 100. Forexample, the modules may occupy spaces or voids between the firstbracket 142 and the second bracket 144, while also engaging the firstbracket 142 and/or the second bracket 144. Accordingly, the modules mayprevent the bracket assembly 140 from unwanted twisting or bending.

FIG. 3 illustrates an exploded view of the system 100 shown in FIGS. 1and 2, showing the bracket assembly 140, the modules, and additionalfeatures. For purposes of simplicity, the flexible circuits are removedfrom the modules. Although the first bracket 142 is designed to combinewith the second bracket 144 to hold and maintain the modules in a fixedposition, the first bracket 142 may include through holes to accommodatethe modules. For example, the first bracket 142 may include a throughhole 154 designed to receive a barrel of the first camera module 112.The first bracket 142 may further include a through hole 156 designed toreceive a raised portion of the light emitting module 114. The firstbracket 142 may include a through hole 158 designed to receive a barrelof the second camera module 116. Accordingly, the aforementioned barrelsand raised portions may protrude through the first bracket 142 via therespective through holes.

The first bracket 142 and the second bracket 144 may be secured togetherby, for example, a welding operation. For example, the first bracket 142may include a recessed region that defines a flat or planar portion thatis welded to a corresponding recessed region of the second bracket 144.As shown, the recessed region of the second bracket 144 includes severalcircular weld spots (not labeled). In addition to welding the bracketelements together, adhesives may be used to further secure the modules.For example, the first camera module 112 may secure with the firstbracket 142 and the second bracket 144 by adhesive elements 162 and anadhesive 164, respectively. Also, the light emitting module 114 maysecure with the first bracket 142 and the second bracket 144 by anadhesive element 166 and an adhesive element 168, respectively. Also,the second camera module 116 may secure with the first bracket 142 andthe second bracket 144 by adhesive elements 172 and an adhesive element174, respectively. In some embodiments, at least some of theaforementioned adhesives include an electrically conductive adhesive. Inthis manner, the modules may be electrically coupled with the firstbracket 142 and/or the second bracket 144. Further, when the firstbracket 142 is secured with the second bracket 144, the modules may beelectrically grounded to an electronic device (not shown) by way of thefirst spring element 146 and/or the second spring element 148. This willbe shown below. Furthermore, the aforementioned bracket elements(including the spring elements), being formed from a metal, may alsoprovide a thermally conductive pathway that allows heat dissipation ofat least one of the modules of the vision system 110 by way of at leastone of the bracket elements.

Due in part to bracket assemblies described herein being used as rigidcomponents designed to maintain the modules in a fixed position, atleast some part of a bracket assembly may be reinforced to enhance theoverall strength. For example, FIG. 4 illustrates an exploded view of analternate embodiment of a bracket 242, showing the bracket 242 formedfrom several structural components, in accordance with some describedembodiments. The bracket 242 may substitute for the first bracket 142(previously shown) and may be used with bracket assemblies describedherein. As shown, the bracket 242 includes a multi-piece assembly thatincludes a first bracket part 252, a second bracket part 254, and athird bracket part 256. In this regard, the bracket 242 may be referredto as a bracket sub-assembly.

The first bracket part 252 may include a first section 262 designed toreceive a module, such as the first camera module 112 (shown in FIG. 3).The first bracket part 252 may further include a second section 264designed to receive a module, such as the second camera module 116(shown in FIG. 3). The first bracket part 252 may further include thirdsection 266, or recessed section, that is recessed with respect to thefirst section 262 and the second section 264. The third section 266 maybe recessed in order to receive an additional component or components.This will be further shown below. Also, the third section 266 mayinclude a through hole 268, or opening, that assists in aligning one ofthe aforementioned components.

In order to form the first bracket part 252, the first bracket part 252may undergo a cutting and stamping operation. The stamping operation mayshape the first bracket part 252 and provide the first bracket part 252with additional structural rigidity. For example, the stamping operationmay form a first inclined section 272 between the first section 262 andthe third section 266. The first inclined section 272 may prevent thefirst section 262 from bending or pivoting (along the Y-axis) withrespect to the third section 266 along an intersection that joins thefirst section 262 and the third section 266. Also, the stampingoperation may form a second inclined section 274 between the secondsection 264 and the third section 266. The second inclined section 274may prevent the second section 264 from bending or pivoting (along theY-axis) with respect to the third section 266 along an intersection thatjoins the second section 264 and the third section 266. In this manner,when the first section 262 and the second section 264 are prevented fromrotational movement with respect to the third section 266, the modules(such as the first camera module 112 and the second camera module 116shown in FIG. 3) are prevented from relative movement with respect toeach other, thereby maintaining the vision system 110 (shown in FIG. 1)is unaltered state.

The second bracket part 254 may be secured (by welding, soldering,and/or other adhering methods) to an internal region of the firstbracket part 252. The second bracket part 254 may be designed to carry amodule, such as the light emitting module 114 (shown in FIG. 1). In thisregard, the second bracket part 254 may be referred to as a modulecarrier. By initially forming the second bracket part 254 separate fromthe first bracket part 252, and then securing the second bracket part254 with the first bracket part 252, a joint (or joints) formed betweenthe first bracket part 252 and the second bracket part 254 providesadditional stability and rigidity. The joint(s) may further fix thesecond bracket part 254 with respect to the first bracket part 252, andaccordingly, may fix a module and prevent the module carried by thesecond bracket part 254 from relative movement with respect to othermodules. Also, the third bracket part 256 may act as a support member orsupporting element that extends substantially across a dimension (suchas a length along the X-axis) of the first bracket part 252. The thirdbracket part 256 may be secured with the first bracket part 252 throughany manner previously described for securing the second bracket part 254with the first bracket part 252. Several circular weld spots (notlabeled) are shown along the first section 262, the second section 264,and the third section 266 of the first bracket part 252. The thirdbracket part 256 may prevent both the first section 262 and the secondsection 264 from bending or pivoting (along the Y-axis) with respect tothe third section 266. As a result, the third bracket part 256 mayprevent a module (or modules) from relative movement with respect toother modules of a vision system (such as the vision system 110 shown inFIG. 1). Also, as shown in FIG. 4, the second section 264 may include anextension 276 and a clamp 278 secured with the extension 276. The clamp278 may be used to secure a second bracket (not shown) with the bracket242.

FIG. 5 illustrates a rear view of an alternate embodiment of a bracket344, in accordance with some described embodiments. The bracket 344 maysubstitute for the second bracket 144 (previously shown) and may be usedwith bracket assemblies described herein. Also, the bracket 344 can beused in conjunction with the first bracket 142 (shown in FIG. 1) or thebracket 242 (shown in FIG. 4). Regarding the bracket 242 in FIG. 4, thebracket 344 may include a first section 362 and a second section 364designed to pair with the first section 262 and the second section 264,respectively, of the bracket 242 (shown in FIG. 4). It should be notedthat the bracket 344 should be rotated 180 degrees around the Y-axisprior to combining with the bracket 242 (shown in FIG. 4). The bracket344 may further include a third section 366, or recessed section, thatis recessed with respect to the first section 362 and the second section364. The third section 366 may be recessed in order to engage the thirdsection 266 (shown in FIG. 4). In this regard, the bracket 242 (shown inFIG. 4) may be secured with the bracket 344 at their respective thirdsections by, for example, welding, fastening, clipping, adhering, or thelike. Also, the third section 366 may include a through hole 368, oropening, that assists in aligning one of the aforementioned components.The bracket 344 may further include a fourth section 372 designed toreceive a module, such as a light emitting module 114 (shown in FIG. 3).In order to draw heat from a light emitting module, the fourth section372 may include a through hole 374, or opening, designed to receive aheat sinking element (not shown) that thermally couples to the lightemitting module.

The bracket 344 may further include a first spring element 376 and asecond spring element 378, each of which is designed to flex against astructure (such as a housing or enclosure) and provide a biasing forceaway from the structure. Also, the second section 364 may include asupport column 382 designed to pair with the clamp 278 (shown in FIG.4), thereby further securing the bracket 344 with the bracket 242 (shownin FIG. 4) to further secure the modules.

FIG. 6 illustrates a plan view of an embodiment of a vision system 310positioned in a bracket assembly 340, showing the bracket assembly 340maintaining spatial relationships between the modules, in accordancewith some described embodiments. The vision system 310 and the bracketassembly 340 may include any features described herein for a visionsystem and a bracket assembly, respectively. As shown, the vision system310 may include a first camera module 312, a light emitting module 314,and a second camera module 316. When positioned in the bracket assembly340, the light emitting module 314 is separated by from the secondcamera module 316 by a distance 320. In particular, the distance 320represents a distance between a center point 324 of the light emittingmodule 314 (shown in the enlarged view) and a center point 326 of thesecond camera module 316. The bracket assembly 340 is designed tomaintain the center point 324 with in a range 332, or tolerance, toensure that the center point 324 of the light emitting module 314 iswithin an acceptable range or tolerance of the distance 320 from thecenter point 326 of the second camera module 316. In some embodiments,the range 332 is less than 1 millimeter. In some embodiments, the range332 is approximately 120 to 200 micrometers. In a particular embodiment,the range 332 is 160 micrometers, or at least approximately 160micrometers. It should be noted that the bracket assembly 340 isdesigned to maintain the first camera module 312 at a predetermineddistance from the second camera module 316. By maintaining thesedistances, the bracket assembly 340 ensures the vision system 310 canaccurately and reliably provide information related to objectrecognition. Further, when the bracket assembly 340 and the visionsystem 310 are positioned in an electronic device (not shown), anyexternal load or force to the electronic device that causes movement ofthe bracket assembly 340 may also cause the same amount of movement toeach module of the vision system 310 so that there is little or norelative movement among the modules with respect to other modules.

FIG. 7 illustrates an isometric view of an embodiment of a lightemitting module 414, in accordance with some described embodiments. Asshown, the light emitting module 414 may include a light emitter 416held by a substrate 418. In some embodiments, the light emitter 416emits light in the non-visible spectrum, such as IR light. Further, thelight emitter 416 can be designed to emit IR laser light. However, insome embodiments (not shown in FIG. 7), the light emitter 416 produceslight other than IR light. The light emitting module 414 may furtherinclude an optical structure 422 positioned over the light emitter 416.The optical structure 422 may include a transparent material (such asglass) folded into multiple portions. The optical structure 422 isdesigned to reflect or bend a light emitted from the light emitter 416within the optical structure 422 in order to provide an increasedoptical path for the light. This will be shown below.

The light emitting module 414 may further an optical element 424positioned over the optical structure 422 in a manner such that lightreceived by, and reflected from, the optical structure 422 passesthrough the optical element 424. The optical element 424 may secure withthe optical structure 422 by an adhesive 426. In some embodiments, theoptical element 424 is a diffractive optical element. In this manner,the light received from the optical structure 422, which may include aone-dimensional light beam, may be split into a two-dimensional array orpattern of light to create a dot pattern of light. The array of lightmay then exit the optical element 424. This will be shown below.

Also, in some instances, the light emitted by the light emitter 416 mayinclude a relatively high intensity. However, after exiting the opticalelement 424 as a dot pattern, the intensity may be sufficiently reduced,and as a result, the light from the light emitting module 414 is safefor human use. In order to account for instances in which the opticalelement 424 is removed from the optical structure 422, the lightemitting module 414 may further include a flexible circuit 428 securedwith the optical element 424. The flexible circuit 428 may also securewith the substrate 418 and may electrically couple to the light emitter416. The flexible circuit 428 may use the optical element 424 as a“plate” and form a parallel-plate capacitor with the optical element 424by supplying an electrical charge to a plate (not shown) of the flexiblecircuit 428. In this manner, when the optical element 424 is removedfrom the optical structure 422 (or is otherwise no longer positionedover the light exiting the optical structure 422), the flexible circuit428 detects a change in capacitance, and provides an input used to powerdown the light emitter 416 and prevent the light emitter 416 fromemitting light. Accordingly, the flexible circuit 428 acts as a safetymechanism to prevent high intensity light from exiting the opticalstructure 422 without also passing through the optical element 424.

FIG. 8 illustrates a side view of the light emitting module 414 shown inFIG. 7, further showing additional features of the light emitting module414. For purposes of illustration, the flexible circuit 428 is removed.Also, a partial cross sectional view of the substrate 418 is shown inorder to view the light emitter 416 and a heat sinking element 432thermally coupled to the light emitter 416. The heat sinking element 432is designed to draw heat away from the light emitter 416 during use. Asshown, the light emitter 416 generates a light beam (shown as a dottedline 434) that passes through the optical structure 422. The opticalstructure 422 causes the light beam to reflect several times (within theoptical structure 422) such that the optical path increases do a desiredoptical “length.” The light beam exits the optical structure 422 andenters the optical element 424, where the light beam is split intomultiple light rays (represented by multiple dotted lines 436). Theoptical element 424 is designed to project a desired dot pattern. Insome embodiments, the projected dot pattern includes an array of dots,with adjacent dots equidistantly spaced apart from one another. Thiswill be shown below.

When a bracket assembly and a vision system carried by the bracketassembly are placed in an electronic device, the bracket assembly maynot be directly secured to a structural component (such as a housing orenclosure) of the electronic device. However, the electronic device isdesigned to align the bracket assembly, and accordingly, the visionsystem, in a precise manner. FIG. 9 illustrates an isometric view of anembodiment of an alignment module 508, in accordance with some describedembodiments. The alignment module 508 can be fastened (by adhesives, asan example) to a transparent cover of an electronic device, with thetransparent cover providing a protective cover to a display assembly forthe electronic device. In this manner, while the transparent cover islowered onto the enclosure, the alignment module 508 is designed toengage the vision system, causing both the vision system and the bracketassembly to move or shift (relative to the enclosure) to a desiredlocation in the electronic device. This will be shown and describedbelow.

As shown, the alignment module 508 may include a first section 512 thatincludes an opening 514 that defines a through hole. The opening 514 isdesigned to receive at least a portion of a module of a vision system,such as the first camera module 112 (shown in FIG. 1). In particular,the opening 514 may include a size and shape to receive a barrel of themodule. The alignment module 508 may further include a second section522 that includes an opening 524 that defines a through hole. Theopening 524 is designed to receive at least a portion of a module of avision system, such as the second camera module 116 (shown in FIG. 1).In particular, the opening 524 may include a size and shape to receive abarrel of the module. The opening 514 and the opening 524 in the firstsection 512 and the second section 522, respectively, may providealignment structures for the alignment module 508.

While the aforementioned openings of the alignment module 508 aredesigned to receive at least a portion of a module, the openings mayinclude different configurations that assist the alignment module 508 inshifting the modules to a desired location in the electronic device. Forexample, the first section 512 may include an extended portion 516 thatincludes a contoured region 518 that defines a reduced diameter of theopening 514 from a first end (such as the bottom end) to a second end(such as the top end) of the alignment module 508. Also, the extendedportion 516 may wrap around a majority of the opening 514. In thismanner, when a module (or a barrel of a module) extends through thefirst section 512, the extended portion 516—having a contoured region518 that wraps around a majority of the opening 514—provides arelatively high precision, and minimal tolerance, alignment to themodule. In this manner, the remaining modules may also be aligned withrelatively high precision, as a result of the modules moving in harmonyin the bracket assembly that carries the remaining modules and preventsrelative movement of the modules. The second section 522 of thealignment module 508 may include an extended portion 526 that forms agenerally semicircular design such that a diameter of the opening 524 inthe second section 522 remains generally constant. In other words, thesecond section 522 does not include a contoured region. The secondsection 522 may be used to provide an angular alignment to a module whenthe module (or a barrel of the module) extends through the opening 524.The angular alignment provided by the second section 522 may complimentthe high precision alignment of the first section 512, thereby providingprecise and controlled alignment of the modules within an electronicdevice.

In addition to providing alignment to modules of a vision system, thealignment module 508 may be used to seat and align additionalcomponents. For example, an electronic device (not shown) that includesan alignment module 508 may further include an audio module 532 designedto emit acoustical energy in the form of audible sound. The audio module532 may include a snout 536. The alignment module 508 may include anopening 534 that receives the snout 536. In order to prevent liquidingress at the opening 534, a sealing element 538 may be positioned inthe opening 534 and engaged with the snout 536. The sealing element 538may include a liquid-resistant and compliant material, such as liquidsilicone rubber.

An electronic device that includes the alignment module 508 may furtherinclude a microphone 542 designed to receive acoustical energy. In orderto provide an acoustical pathway, the alignment module 508 may includean opening 544. As shown, the opening 544 may include a diagonal throughhole opening. Also, an electronic device that includes the alignmentmodule 508 may further include a sensor 546. In some embodiments, thesensor 546 includes an ambient light sensor designed to detect an amountlight intensity incident on the electronic device. The sensor 546 mayprovide an input to the electronic device, with the input used tocontrol an additional light source used by a vision system within theelectronic device. This will be discussed below. In order to accommodatethe sensor 546, the alignment module 508 may include a rail 540 designedto secure the sensor 546. Also, an electronic device that includes thealignment module 508 may further include a sensor 548. In someembodiments, the sensor 548 includes a proximity sensor that determineswhether a user is approximately within a predetermined distance from thesensor 548. The sensor 548 can be used to provide an input to aprocessor (not shown in FIG. 10) of the electronic device that is usedto, for example, control a display assembly (not shown in FIG. 10) ofthe electronic device. As an example, the input provided by the sensor548 may correspond to a determination that the user is withinpredetermined distance of an electronic device (not shown in FIG. 10),with the input used as a determination whether the display assembly ison or off.

In some instances, the vision system may require additional lighting toprovide reliable object recognition. As a result, an electronic devicethat includes the alignment module 508 may further include a lightingelement 556. The alignment module 508 may include an opening 544designed to receive the lighting element 556. In some embodiments, thelighting element 556 is a floodlight designed to illuminate duringlow-light conditions. The sensor 546 may determine when external lightintensity incident on the electronic device, or a component of theelectronic device (such as a transparent protective layer), constitutesa low-light condition, or a condition of relatively low external light.Also, in some instances, the alignment module 508 is formed from amolding operation, such as an injection molding operation. In thisregard, a moldable plastic material may be used to form the alignmentmodule 508. As a result, the alignment module 508 may include an overallrelatively low strength, as compared to an all-metal alignment module.However, the alignment module 508 may include multiple rails thatincrease the strength and rigidity of the alignment module 508. Forexample, the alignment module 508 may include a first rail 558 and asecond rail 562. The first rail 558 and the second rail 562 may includea metal. Also, during a molding operation of the alignment module 508,the first rail 558 and the second rail 562 may be inserted into a moldedcavity (not shown). Accordingly, the first rail 558 and the second rail562 may be referred to as insert molded elements. Also, the first rail558 and the second rail 562 may define, or at least partially define,the opening 544.

Also, in some instances, the alignment module 508 may include a moldablematerial that blocks light within a certain spectrum. For example, insome embodiments, the alignment module 508 includes a material thatblocks or shields some components from IR light. For example, thealignment module 508 may include an IR blocking material that blocks IRlight having a wavelength of approximately 900 micrometers or higher. Inthis manner, the microphone 542 can be shielded from “noise” created byIR light.

FIG. 10 illustrates a side view of the lighting element 556 shown inFIG. 9, showing additional features of the lighting element 556. Thelighting element 556 may include a light emitter 566 and a Dopplermodule 568. The light emitter 566 may include non-visible light, such asIR light. The Doppler module 568 is designed to detect motion. In thisregard, the Doppler module 568 may assist in determining whether toactivate the light emitter 566.

FIG. 11 illustrates a side view of an alignment module 608 positionedover a bracket assembly 640 and a vision system 610 positioned in thebracket assembly 640, prior to an assembly operation. The alignmentmodule 608, the vision system 610, and the bracket assembly 640 mayinclude any features described herein for an alignment module, a visionsystem, and a bracket assembly, respectively. As shown, the bracketassembly 640 includes a first section 662, a second section 664, and athird section 666 designed to interact with a first section 612, asecond section 614, and a third section 616, respectively, of thealignment module 608. Also, the bracket assembly 640 is designed tocarry a first camera module 672, a light emitting module 674, and asecond camera module 676.

The alignment module 608 may align and/or carry several components, suchas an audio module 632, a microphone 642, a sensor 646 (positionedbehind the audio module 632), and a lighting element 656. The alignmentmodule 608 may also align and/or carry a proximity sensor (not shown inFIG. 11). The alignment module 608 may be designed to position theaforementioned components at least partially in the third section 666(or recessed section). Also, the audio module 632, the microphone 642,the sensor 646, and the lighting element 656 may electrically couple toa flexible circuit 660 that can electrically couple to a processor (notshown in FIG. 11). The first section 612 of the alignment module 608 mayfurther include an opening 618 designed to receive a barrel 682 of thefirst camera module 672. The first section 612 may further include anextended portion 620 having a contoured region 622 (similar to thecontoured region 518, shown in FIG. 9) that defines a reduced diameterof the opening 618 of the first section 612 from a first end (such asthe bottom end) to a second end (such as the top end) of the alignmentmodule 608, with the extended portion 620 wrapping around a majority ofthe opening 618. The second section 614 may include an opening 624designed to receive a barrel 686 of the second camera module 676. Thesecond section 614 of the alignment module 608 may include an extendedportion 626 (similar to the extended portion 526, shown in FIG. 9) thatforms a generally semicircular design such that a diameter of theopening 624 in the second section 614 remains generally constant.

During an assembly operation of an electronic device (not shown in FIG.11), the alignment module 608, secured with a transparent cover (notshown in FIG. 11), is lowered down toward the vision system 610 and thebracket assembly 640. While the transparent cover is lowered, thealignment module 608 may contact the barrel 682 of the first cameramodule 672, as an example, and apply a force to the first camera module672 that causes the bracket assembly 640, along with the components ofthe vision system 610, to shift to a desired location in the electronicdevice. This will be further shown below.

FIG. 12 illustrates a side view of the alignment module 608, the visionsystem 610, and the bracket assembly 640 shown in FIG. 11, furthershowing the alignment module 608 and several modules and components inrelation to the alignment module 608, in accordance with some describedembodiments. As shown, the alignment module 608 is positioned over andonto the bracket assembly 640. Also, the opening 618 of the firstsection 612 of the alignment module 608 may conform more closely to sizeand shape of the barrel 682 of the first camera module 672 (labeled inFIG. 11), as compared to the conformity of the opening 624 of the secondsection 614 with respect to the barrel 686 of the second camera module676 (labeled in FIG. 11). In this regard, the alignment module 608 canprovide a “fine,” or precise, positioning of vision system 610 by usingthe opening 618 of the first section 612. Further, the alignment module608 can provide an angular positioning of vision system 610 by using theopening 624 of the second section 614. Also, while the light emittingmodule 674 is generally not integrated with the alignment module 608,the light emitting module 674 can nonetheless be properly aligned basedon the alignment module 608 shifting the bracket assembly 640, whichcorresponds to a shift and alignment of the light emitting module 674.Also, the alignment module 608 includes a rail 688 used to secure andalign the sensor 646. As shown, the sensor 646 may be positioned betweena portion of the alignment module 608 and the rail 688.

FIG. 13 illustrates a plan view of an embodiment of an electronic device700, in accordance with some described embodiments. In some embodiments,the electronic device 700 is a tablet computing device. In otherembodiments, the electronic device 700 is a wearable electronic device.In the embodiment shown in FIG. 13, the electronic device 700 is aportable electronic device, commonly referred to as a smartphone. Theelectronic device 700 may include an enclosure 702 that includes abottom wall (not shown) and several sidewall components, such as a firstsidewall component 704, a second sidewall component 706, a thirdsidewall component 708, and a fourth sidewall component 710. Thesidewall components may combine with the bottom wall to define aninternal volume, or cavity, to hold the internal components of theelectronic device 700. In some embodiments, the bottom wall includes anon-metal, such as glass, plastic, or other transparent material. Also,in some embodiments, the first sidewall component 704, the secondsidewall component 706, the third sidewall component 708, and the fourthsidewall component 710 include a metal, such as steel (includingstainless steel), aluminum, or an alloy that includes aluminum and/orsteel. Further, each of the aforementioned sidewall components may beseparated and isolated from each other by a filler material thatincludes a non-metal such that the sidewall components are electricallyisolated from each other. For example, the enclosure 702 may include afirst filler material 720 that separates the first sidewall component704 from the second sidewall component 706 and the fourth sidewallcomponent 710. The enclosure 702 may further include a second fillermaterial 721 that separates the third sidewall component 708 from thesecond sidewall component 706 and the fourth sidewall component 710. Thefirst filler material 720 and the second filler material 721 may includea molded plastic and/or a molded resin. In some instances, at least oneof first filler material 720 and the second filler material 721 includesan antenna component (not shown in FIG. 13).

The electronic device 700 may further include a transparent cover 712that secures over the enclosure 702, and in particular, theaforementioned sidewall components of the enclosure 702. In this regard,the first sidewall component 704, the second sidewall component 706, thethird sidewall component 708, and the fourth sidewall component 710 mayprovide an edge region that defines an opening that receives thetransparent cover 712. The transparent cover 712 may include a materialsuch as glass or sapphire, or another suitable transparent material.When formed from glass, the transparent cover 712 may be referred to asa cover glass. Also, the transparent cover 712 may further include athrough hole 714, or opening. The through hole 714 is labeled in theenlarged view. The electronic device 700 may further include an audiomodule (for example, the audio module 532 shown in FIG. 9) aligned withthe through hole 714 in order to allow acoustical energy generated fromthe audio module to exit the electronic device 700 via the through hole714. The electronic device 700 may further include a display assembly716 (shown as a dotted line) that is covered or overlaid by thetransparent cover 712. Accordingly, the transparent cover 712 may bereferred to as a protective layer. The display assembly 716 may includemultiple layers, with each layer serving one or more particularfunctions. This will be further shown below. The electronic device 700may further include a display cover 718 that is covered by thetransparent cover 712 and defines a border around the display assembly716. In particular, the display cover 718 may substantially cover anouter edge of the display assembly 716. The electronic device 700 mayinclude control inputs. For example, the electronic device 700 mayinclude a first button 722 and a second button 724, each of which isdesign to allow for a user input to control the display assembly 716.The first button 722 and/or the second button 724 may be used to actuatea switch (not shown in FIG. 13), thereby generating an input to aprocessor (not shown in FIG. 13).

As shown, the transparent cover 712 may include a rectilinear designdefined by the sidewall components of the enclosure 702. However, insome instances, as shown in FIG. 13, the display assembly 716 (and atleast some of its associated layers) may include a notch 726 formed inthe display assembly 716. The notch 726 is also labeled in the enlargedview. The notch 726 may represent a reduced surface area of the displayassembly 716 (as compared to that of the transparent cover 712). Theelectronic device may include a masking layer 728 applied to theunderside, or bottom surface, of the transparent cover 712 in a locationcorresponding to the notch 726. The masking layer 728 may include an inkmaterial (or materials) that provides an appearance (in terms of color)that is substantially similar to the appearance of the display assembly716 (when the display assembly 716 is off). For example, both themasking layer 728 and the display assembly 716 may include a darkappearance that resembles black. Also, in some instances, the displaycover 718 may include an appearance (in terms of color) that is similarto both the masking layer 728 and the display assembly 716 (when thedisplay assembly 716 is off).

Generally, the masking layer 728 includes an opaque material that blocksthe passage of light, and accordingly, may obscure vision into theelectronic device 700. However, the masking layer 728 may includeseveral openings that represent a void in the masking layer 728. Forexample, as shown in the enlarged view, the masking layer 728 mayinclude a first opening 732 and a second opening 734. When theelectronic device 700 includes a vision system (such as the visionsystem 610 shown in FIG. 11), the first camera module (such as the firstcamera module 672 shown in FIG. 11) and the light emitting module (suchas the light emitting module 674 shown in FIG. 11) may align with thefirst opening 732 and the second opening 734, respectively. The maskinglayer 728 may further include a third opening 736 and a fourth opening738. The vision system (such as the vision system 610 shown in FIG. 11)may include a second camera module (such as the second camera module 676shown in FIG. 11) and a lighting element (such as the lighting element656 shown in FIG. 11) that align with the third opening 736 and thefourth opening 738, respectively. The masking layer 728 may furtherinclude a fifth opening 742. When the electronic device 700 includes asensor (such as the sensor 646 shown in FIG. 11), the sensor may alignwith the fifth opening 742. Also, in order to provide consistency, thesize and shape of the through hole 714 (in the x-y plane) may beidentical, or at least substantially similar, to that of the fifthopening 742. While the masking layer 728 is shown as having severalopenings, each of the openings may be filled with a material thatprovides at least some masking and/or some consistency in appearance (interms of color). In this regard, the openings may be not be easily seenby a user, thereby hiding the sensor and the modules of the visionsystem, and the overall consistency of the electronic device 700 is atleast partially maintained in terms of appearance. Also, as shown in theenlarged view, the first opening 732, the second opening 734, the thirdopening 736, and the fourth opening 738 may be centered with the maskinglayer 728 in both the X- and Y-dimensions. Further, the through hole 714and the fifth opening 742 may be centered with respect to the maskinglayer 728 in both the X- and Y-dimensions.

However, the materials used to cover the openings of the masking layer728 may differ. For example, FIG. 14 illustrates a cross sectional viewtaken along line A-A in FIG. 13, showing a location of the transparentcover 712, the masking layer 728 secured with the transparent cover 712,and several layers of material secured with the transparent cover 712,in accordance with some described embodiments. As shown, the openings ofthe masking layer 728 may be filled. For example, the first opening 732,the second opening 734, the third opening 736, and the fourth opening738 may include a first material 752, a second material 754, a thirdmaterial 756, and a fourth material 758, respectfully. In someembodiments, the first material 752, the second material 754, the thirdmaterial 756, and the fourth material 758 include an ink material thatpermits IR light passage, while blocking other forms of light (outsidethe IR frequency range of light). This allows modules (not shown) of avision system to emit IR light through the aforementioned materials andthe transparent cover 712, while also allowing reflected IR light toenter through the transparent cover 712 and the aforementioned materialssuch that the IR light is received by some of the modules (such as thesecond camera module 676, shown in FIG. 11). Generally, the materialused to fill the openings may include any material that permits lightpassage associated with light emitted by the modules of the visionsystem, while blocking other types of light that does not fall within apredetermined frequency range. Also, in some embodiments, the openingsare symmetrically displaced around the through hole 714. For example,the first opening 732 may be displaced from the through hole 714 at adistance that is the same as that between the fourth opening 738 and thethrough hole 714. Also, the second opening 734 may be displaced from thethrough hole 714 at a distance that is the same as that between thethird opening 736 and the through hole 714.

FIG. 15 illustrates a cross sectional view taken along line B-B in FIG.13, showing a different location of the transparent cover 712 and amaterial positioned in an opening of the masking layer 728. As shown,the fifth opening 742 may be filled by a fifth material 760. In someembodiments, the fifth material 760 includes a material that permitsvisible light passage, while blocking other forms of light. This allowsa sensor (such as the sensor 646 shown in FIG. 11) to receive visiblelight through the fifth material 760 and the transparent cover 712.Referring again to FIG. 14, the first material 752, the second material754, the third material 756, the fourth material 758, and the fifthmaterial 760 (shown in FIG. 15) may not only provide a specific functionof light passage, but also may provide an appearance (in terms of color)that at least partially resembles the appearance of the masking layer728. In this manner, the materials that fill the openings can generallyblend with the masking layer 728, in terms of appearance, such that theopenings are less noticeable.

FIG. 16 illustrates a cross sectional view of the electronic device 700taken along line C-C in FIG. 13, showing various layers of the displayassembly 716. For purposes of illustration and simplicity, severalcomponents (such as a circuit board, battery, rear camera, flexiblecircuits) are removed. As shown, the transparent cover 712 may securewith the sidewall components (the second sidewall component 706 and thefourth sidewall component 710 are shown) by way of a frame 730 that isadhesively secured with both the transparent cover 712 and the sidewallcomponents by an adhesive (not labeled), which may include pressuresensitive adhesive. The display assembly 716 may include a touch inputlayer 772 designed to form a capacitive coupling by way of a touch inputto the transparent cover 712. The display assembly 716 may furtherinclude a display layer 774 designed to present visual information inthe form of textual information, still images, and/or video images. Aninput to the touch input layer 772 may generate a control input tocontrol what is presented on the display layer 774. The display assembly716 may further include a force touch layer 776 designed to determine anamount of force applied to the transparent cover 712. A control inputcan be generated when the force applied to the transparent cover 712equals or exceeds a predetermined amount of force, as determined by theforce touch layer 776.

FIG. 17 illustrates a plan view of the electronic device 700 shown inFIG. 13, with the transparent cover and the display assembly removed. Asshown, the electronic device 700 includes a bracket assembly 840 thatcarries a vision system 810 positioned in the enclosure 702. The bracketassembly 840 and the vision system 810 may include any featuresdescribed herein for a bracket assembly and a vision system,respectively. As shown, the vision system 810 includes a first cameramodule 812, a light emitting module 814, and a second camera module 816.The first camera module 812, the light emitting module 814, and thesecond camera module 816 may include any features described herein for afirst camera module, a light emitting module, and a second cameramodule, respectively. The bracket assembly 840 is not only designed tocarry and protect the aforementioned modules, but also to maintain apredetermined distance or separation between the modules and limit orprevent relative movement of the modules with respect to other modules.

The electronic device 700 may further include a circuit board 820 thatincludes one or more processor circuits (not shown), such as integratedcircuits, that provide the main processing functions of the electronicdevice 700. Each module may include a flexible circuit that electricallycouples to the circuit board 820. For example, the first camera module812 includes a first flexible circuit 822 used to electrically couplethe first camera module 812 to the circuit board 820, the light emittingmodule 814 may include a second flexible circuit 824 used toelectrically couple the light emitting module 814 to the circuit board820, and the second camera module 816 may include a third flexiblecircuit 826 used to electrically couple the second camera module 816 tothe circuit board 820. With the exception of the electrical andmechanical connections between the circuit board 820 and theaforementioned flexible circuits of the modules, no mechanicalconnections exist between the bracket assembly 840 and the enclosure 702(or another other structural features in the enclosure 702).Accordingly, the bracket assembly 840 is allowed to “roam” or “float”(that is, move) in the enclosure 702 prior to a final assembly. However,when the transparent cover 712 (shown in FIG. 13) is secured with theenclosure 702, the bracket assembly 840 can be aligned in the enclosure702 and generally limited in movement. This will be further shown anddiscussed below. Also, the enclosure 702 may include a bottom wall 740,or back wall. The bottom wall 740 may be integrally formed with thesidewall components to define a unibody structure, or may include aseparate structural material(s) that are coupled together during anassembly operation. Also, the bottom wall 740 may include an opening 741that allow an additional camera module (not shown in FIG. 17) tocaptures images. The additional camera module can be designed to captureimages in a direction opposite to that of the first camera module 812.

FIG. 18 illustrates a plan view of the transparent cover 712 shown inFIG. 13, further showing an alignment module 808 secured with thetransparent cover 712. The alignment module 808 (shown as dotted lines)is secured with an underside (also referred to as a rear surface orbackside) of the transparent cover 712 by, for example, an adhesive.Also, the alignment module 808 may include any features described hereinfor an alignment module. The alignment module 808 may be secured withthe transparent cover 712, and may provide a desired alignment of thevision system 810 (shown in FIG. 17). For example, while the transparentcover 712 is being assembly with the enclosure 702 (shown in FIG. 17),the alignment module 808 can align the first camera module 812 and thelight emitting module 814 (both shown in FIG. 17) with the first opening732 and the second opening 734, respectively, of the masking layer 728.Further, when the transparent cover 712 is secured with the enclosure702 (shown in FIG. 17), the alignment module 808 can align the secondcamera module 816 (shown in FIG. 17) with the third opening 736 of themasking layer 728. The materials that fill the openings (shown in FIGS.14 and 15) are not labeled in FIG. 18 for purposes of simplicity.Although not shown, additional components can be aligned using thealignment module 808. For example, the alignment module 808 may align alighting element (such as the lighting element 556 shown in FIG. 9) withthe fourth opening 738. The alignment module 808 may further align anaudio module and a microphone (such as the audio module 532 and themicrophone 542 shown in FIG. 9) with the through hole 714 of thetransparent cover 712. The alignment module 808 may further align asensor (such as the sensor 546 shown in FIG. 9) with the fifth opening742.

While the bracket assembly 840 is designed to carry the vision system810 (both shown in FIG. 17), the alignment module 808 is also designedto carry components (in addition to providing alignment to thecomponents). For example, FIG. 19 illustrates a cross sectional view ofthe transparent cover 712 and the alignment module 808 secured with thetransparent cover 712, further showing an audio module 832, a microphone834, and a lighting element 836. The audio module 832, the microphone834, and the lighting element 836 may include any features describedherein for an audio module, a microphone, and a lighting element,respectively. Although not shown, a sensor may be carried by thealignment module 808 in a manner previously described. In order to hidethe audio module 832 and the microphone 834 from view, an acoustic mesh850 may secure (by adhesives, for example) to the transparent cover 712and cover the through hole 714, thereby covering the audio module 832and the microphone 834. The acoustic mesh 850 may include a materialthat permits acoustical energy to pass through the acoustic mesh 850. Asshown, the alignment module 808 may align the audio module 832 and themicrophone 834 with the through hole 714 to allow the audio module 832and the microphone 834 to access the ambient environment.

In some instances, the alignment module 808 may be modified to provideadditional surface area. For example, as shown in the enlarged view, thealignment module 808 may include a rib 862 designed to receive anadhesive 872 that secures the alignment module 808 with the transparentcover 712. As shown, the acoustic mesh 850 is positioned between thealignment module 808 and the transparent cover 712. However, in someembodiments (not shown), the acoustic mesh 850 is not positioned betweenthe alignment module 808 and the transparent cover 712. The rib 862 mayprovide the alignment module 808 with additional surface area, therebyallowing for additional space for the adhesive 872. This may prevent theadhesive 872 from flowing into the audio module 832 and altering theacoustical energy emitted by the audio module 832 in an undesiredmanner. Although not labeled, the alignment module 808 may includeadditional ribs designed in a manner similar to that of the rib 862. Insome embodiments, the audio module 832 includes a recessed region 864,or trough, that is proximate to the rib 862. In this manner, if theadhesive 872 extends beyond the rib 862, the adhesive 872 may be caughtor trapped in the recessed region 864, and the adhesive 872 remains outof the audio module 832.

FIG. 20 illustrates a cross sectional view of an alternate embodiment ofa transparent cover 762 and an alignment module 858 secured with thetransparent cover 762, further showing an audio module 882 that ismodified to secure to the transparent cover 762. The transparent cover762, the alignment module 858, and the audio module 882 may include anyfeatures previously described for a transparent cover, an alignmentmodule, and an audio module, respectively. As shown, the audio module882 may be extended (as compared to the audio module 832 shown in FIG.19) and may include ribs, such as a first rib 884 and a second rib 886,used to receive an adhesive 888. Rather than modifying the alignmentmodule 858, the audio module 882, by way of the first rib 884 and thesecond rib 886, can adhesively secure to the transparent cover 762.Also, the audio module 882 may be modified to carry a microphone 892such that both the audio module 882 and the microphone 892 can accessthe ambient environment via a through hole 764 of the transparent cover762.

FIGS. 21-23 illustrate an assembly operation of the electronic device700. In order to properly align the vision system 810 in a desiredmanner, the bracket assembly 840 is placed in the enclosure 702 and isnot affixed to the enclosure 702. In other words, the bracket assembly840 is (initially) free to move relative to the enclosure 702. Duringthe assembly operation, the alignment module 808 may engage one of themodules of the vision system 810, which in turn provides a lateralmoving force of the vision system 810 and the bracket assembly 840 inorder to align the vision system 810 with openings in the masking layer728. Once the assembly operation is complete, the bracket assembly 840may be in a fixed positioned in the enclosure 702 by engagement forcesfrom the alignment module 808 and the enclosure 702, but is nototherwise affixed to the enclosure 702 by fasteners, clips, screws,adhesives, etc.

FIG. 21 illustrates a cross sectional view partially showing theelectronic device 700 shown in FIG. 13, showing an assembly operationbetween the transparent cover 712 and the enclosure 702, in accordancewith some described embodiments. The electronic device 700 may include acircuit 870 that is electrically and mechanically coupled to the audiomodule 832, the microphone 834, the lighting element 836, and a sensor(not shown in FIG. 21). The circuit 870 may include a flexible circuitthat is electrically and mechanically connected to a circuit board (suchas the circuit board 820 shown in FIG. 17), thereby placing the audiomodule 832, the microphone 834, the lighting element 836, and the sensorin communication with the circuit board. Also, the alignment module 808is adhesively secured with the transparent cover 712. The alignmentmodule 808 is aligned with the transparent cover 712 such that when theaudio module 832 is positioned in an opening (not labeled) of thealignment module 808, the audio module 832 is aligned with the throughhole 714 of the transparent cover 712. Further, the microphone 834 maybe aligned with a diagonal opening (not labeled) of the alignment module808, and at least partially aligned with the through hole 714. Also, thelighting element 836 may be positioned in an opening (not labeled) ofthe alignment module 808, and in particular, the lighting element 836may align with an opening of the masking layer 728. This will be furtherdiscussed below. Also, the lighting element 836 may include a heatdissipation structure 838 designed to draw heat from the lightingelement 836 during use of the lighting element 836, thereby providing athermal sink to prevent overheating of the lighting element 836. Theheat dissipation structure 838 may be coupled with the circuit 870.

The bracket assembly 840 may include a first bracket 842 and a secondbracket 844 secured with the first bracket 842 to hold the first cameramodule 812, the light emitting module 814, and the second camera module816 of the vision system 810. Although not labeled, the first cameramodule 812, the light emitting module 814, and the second camera module816 may each include a flexible circuit. Also, although not labeled, thefirst camera module 812, the light emitting module 814, and the secondcamera module 816 may each include an adhesive that secures the modulesto the bracket assembly 840. The adhesive may include an electricallyconductive adhesive that electrically couples the modules to the bracketassembly 840. The first bracket 842 may include a multi-piece assembly,similar to the bracket 242 (shown in FIG. 4). In this regard, the firstbracket 842 may include a first bracket part 852 and a second bracketpart 854 secured with the first bracket part 852. The second bracketpart 854 may be referred to as a module carrier that holds the lightemitting module 814. The first bracket part 852 may attach to the secondbracket 844 and the second bracket part 854 by welding, as an example,thereby electrically coupling the brackets and the parts together. Otherattachment methods that electrically couple the brackets and partstogether are possible. The second bracket 844 may include a first springelement 846 and a second spring element 848 that are used to support thebracket assembly 840 and the vision system 810.

The bottom wall 740 may include a transparent material, such as glass orthe like. In this regard, the bottom wall 740 may include a materialthat is different from the sidewall components shown in FIG. 13.However, in some embodiments (not shown), the bottom wall 740 is formedfrom a metal and the sidewall components (also formed from the metal)are integrally formed from the bottom wall 740. Although not shown, thebottom wall 740 may include a mask that provides an opaque materialacross a major surface of the bottom wall 740. Also, the first springelement 846 and the second spring element 848 may engage a metal layer860 disposed on the bottom wall 740. As a result, the metal layer 860may provide an electrical ground for the first camera module 812, thelight emitting module 814, and the second camera module 816 by way ofadhesives and various structural features of the bracket assembly 840,including the aforementioned spring elements. In some instances, themetal layer 860 is electrically coupled to the sidewall components(shown in FIG. 13).

The second bracket 844 may include an opening that allows a heat sinkingelement 876 to thermally couple with the light emitting module 814,either by direct contact with the light emitting module 814 or by way ofa block (not labeled), as shown in FIG. 21. The heat sinking element 876may include a rolled graphite layer that is thermally coupled to themetal layer 860. Accordingly, the metal layer 860 may provide electricaland thermal dissipation. Regarding the latter, the metal layer 860 maybe referred to as a heat sink or thermal regulator.

FIG. 22 illustrates a cross sectional view of the electronic device 700shown in FIG. 21, further showing the transparent cover 712 beinglowered toward the enclosure 702. As shown in Step 1, the transparentcover 712 moves in a direction toward the enclosure 702 in order tosecure the transparent cover 712 to the enclosure 702. As thetransparent cover 712 is lowered, the alignment module 808 may engage amodule of the vision system 810 (labeled in FIG. 21). For example, asshown in FIG. 22, the alignment module 808 engages the first cameramodule 812. As shown in Step 2, the force provided by the alignmentmodule 808 to the first camera module 812 (by way of the transparentcover 712 moving toward the enclosure 702) causes the first cameramodule 812 to shift in the x-direction, which in turn causes the bracketassembly 840 and the remaining modules to shift along the X-axis (in the“negative” direction). The shifting, or movement, of the modules causesthe modules to align in the electronic device 700 in a desired manner.This will be shown below. In this manner, the first camera module 812may be referred to as an alignment feature that is used by the alignmentmodule 808 to align the modules. However, in some embodiments (not shownin FIG. 22), the alignment module 808 engages a different module of thebracket assembly 840. Also, it should be noted that despite the movementor shifting of the modules, the bracket assembly 840 maintains thespacing between i) the first camera module 812 and the second cameramodule 816, ii) light emitting module 814 and the second camera module816, and iii) the first camera module 812 and the light emitting module814.

While Step 2 shows the bracket assembly 840 and the modules beingshifted in a particular direction, the bracket assembly 840 and themodules may shift in a different direction based the original positionof the bracket assembly 840 and the modules in the electronic device700. For example, when the alignment module 808 engages a differentlocation of the first camera module 812 (as opposite the location shownin FIG. 22), the bracket assembly 840 and the modules may shift in theopposite direction in order to align the modules in the electronicdevice 700. Further, although not shown, the engagement between thealignment module 808 and the first camera module 812 may provide a forcethat causes the bracket assembly 840 and the modules to move in adirection perpendicular to the X-Z plane, such as a “Y-direction” thatis into and out of the page. The engagement between the alignment module808 and the first camera module 812 may provide a force that causes thebracket assembly 840 and the modules to move in two directions, such asalong the X-axis as well as a direction perpendicular to the X-Z plane.Accordingly, in order to properly align the modules, the alignmentmodule 808 may provide a force that moves the modules in two differentdimensions.

FIG. 23 illustrates a cross sectional view of the electronic device 700shown in FIG. 22, with the transparent cover 712 secured with theenclosure 702. The vision system 810 is aligned with the electronicdevice 700 subsequent to the alignment module 808 causing the visionsystem 810 and the bracket assembly 840 to shift. Further, as shown inthe enlarged view, when the vision system 810 is aligned in theelectronic device 700, the first camera module 812 is aligned with thefirst material 752 disposed in the first opening 732 of the maskinglayer 728. The term “aligned” refers to the first material 752 beingpositioned over the first camera module 812 such that the masking layer728 does not block the line of view for the first camera module 812.Also, the light emitting module 814 is aligned with the second material754 disposed in the second opening 734 of the masking layer 728, and thesecond camera module 816 is aligned with the third material 756 disposedin the third opening 736 of the masking layer 728. Also, the lightingelement 836, when positioned in the alignment module 808, is alignedwith the fourth material 758 disposed in the fourth opening 738 of themasking layer 728.

Also, the first spring element 846 and the second spring element 848 mayflex in response to compression forces from the transparent cover 712and the enclosure 702. However, the first spring element 846 and thesecond spring element 848 may provide a biasing force, or counterforce,in a direction of an arrow 890. The biasing force may increase theengagement force between the bracket assembly 840 and the alignmentmodule 808. As a result, the bracket assembly 840 may be held in placewithout any direct fixtures or fasteners that permanently fasten thebracket assembly 840 to the enclosure 702 or the transparent cover 712.In this manner, the vision system 810 is mechanically isolated from theenclosure 702, as the components of the vision system 810 are suspendedby the bracket assembly 840 (which is not affixed to the enclosure 702)such that the components of the vision system 810 are not in contactwith the enclosure 702. The mechanical isolation of the vision system810 with respect to the enclosure 702 allows the components of thevision system 810 to move freely, in accordance with any movement of thebracket assembly 840, without obstruction from the enclosure 702 or anyaffixation or engagement between the vision system 810 and the enclosure702. Although an external force or load force exerted on the electronicdevice 700 may cause movement of the bracket assembly 840 relative tothe enclosure 702, the bracket assembly 840 can maintain a constantseparation between the first camera module 812, the light emittingmodule 814, and the second camera module 816. This ensures thecomponents of the vision system 810 remain at a fixed and predetermineddistance from each other, and may not require a re-calibration setting.Accordingly, any movement of the bracket assembly 840 may correspond toan equal amount of movement of the first camera module 812, the lightemitting module 814, and the second camera module 816 such that there isno relative movement between the modules. Furthermore, due in part tothe mechanical isolation of the vision system 810, a force to theenclosure 702 that causes the enclosure 702 to bend, warp, or otherwisebecome altered may result in the further compression of the first springelement 846 and/or the second spring element 848 without i) affectingthe fixed distance between the components of the vision system 810, andii) causing mechanical contact between components of the vision system810 and the enclosure 702.

Also, the openings of the masking layer 728, and in turn, the materialin the openings, may be separated from the through hole 714 by equaldistances, and accordingly, some of the openings are symmetricallypositioned around the through hole 714. For example, a center point ofthe first opening 732 is positioned a first distance 902 from a centerpoint of the through hole 714, and a center point of the fourth opening738 is positioned a second distance 904 from the center point of thethrough hole 714. The first distance 902 may be the same, or at leastsubstantially similar to, the second distance 904. Also, a center pointof the second opening 734 is positioned a third distance 906 from thecenter point of the through hole 714, and a center point of the thirdopening 736 is positioned a fourth distance 908 from the center point ofthe through hole 714. The third distance 906 may be the same, or atleast substantially similar to, the fourth distance 908. These symmetricrelationships may enhance the overall appearance of the electronicdevice 700. Also, when the assembly operation is complete, the heatdissipation structure 838 and the heat sinking element 876 are coupledto the first bracket part 852 and the metal layer 860, respectively.This places the lighting element 836 and the light emitting module 814in thermal contact with the first bracket part 852 and the metal layer860.

FIG. 24 illustrates an alternate cross sectional view of the electronicdevice 700 shown in FIGS. 21-23, showing the positioning of some of thecomponents within the electronic device 700, in accordance with somedescribed embodiments. As shown, the first bracket part 852 (associatedwith the first bracket 842 in FIG. 21) and the second bracket 844 mayextend beyond the transparent cover 712, in the Y-dimension, and may beat least partially covered by the first sidewall component 704 (alsoshown in FIG. 13). In some instances, the first sidewall component 704provides not only a protective structure but also forms part of anantenna assembly designed as a transceiver to send and receive radiofrequency (“RF”) communication in the form of RF energy. Further, anantenna component (not shown in FIG. 24) of the antenna assembly may beproximate to the first bracket part 852 and/or the second bracket 844.In this regard, due in part to the first bracket part 852 and/or thesecond bracket 844 being formed from metal, the bracket assembly 840 mayelectrically couple to and potentially affect the performance of theantenna assembly. However, the bracket assembly 840 can be grounded tothe metal layer 860 in a manner previously described (see FIG. 21), andaccordingly, may provide a reference ground for the antenna component.As a result, the bracket assembly 840 may complement the use of theantenna assembly so as not to impede the antenna assembly.

The first camera module 812 may be secured with the first bracket part852 by an adhesive layer 912. In some instances, the adhesive layer 912may include an electrically conductive adhesive, thereby electricallycoupling the first camera module 812 with the first bracket part 852.Accordingly, due to the bracket assembly 840 being electrically coupledto the metal layer 860, the first camera module 812 may be electricallycoupled to the metal layer 860 such that the first camera module 812 canbe electrically grounded. Also, the first camera module 812 may beelectrically and mechanically coupled to the first flexible circuit 822that is further electrically and mechanically coupled to the circuitboard 820 (shown in FIG. 17). The first flexible circuit 822 may besecured with the second bracket 844 by an adhesive layer 914. Also, thefirst flexible circuit 822 may pass through an opening between thesecond bracket 844 and a third bracket part 856. The third bracket part856 may include any features previously described for the third bracketpart 256 (shown in FIG. 4). Accordingly, the third bracket part 856 mayact as a support member or supporting element that extends substantiallyacross a dimension (such as a length) of the first bracket part 852.

FIG. 25 illustrates a plan view of a dot pattern 1000 generated by alight source, in accordance with some described embodiments. The dotpattern 1000 may include a light pattern having several dots projectedonto a flat object 1020. The dot pattern 1000 may be generated fromlight produced by a light emitting module, such as the light emittingmodule 114 (shown in FIG. 1). In this regard, the dot pattern 1000 mayinclude IR light that is not visible by the human eye. Also, the dots ofthe dot pattern 1000 may be spaced equidistantly apart in rows andcolumns, when projected onto the flat object 1020. In other words, thepitch between adjacent dots is equal when the dot pattern 1000 isprojected onto the flat object 1020. For example, as shown in theenlarged view, the dot pattern 1000 may include a first dot 1002 and asecond dot 1004 adjacent to the first dot 1002. The first dot 1002 isseparated from the second dot 1004 by a first distance 1012. The dotpattern 1000 may include a third dot 1006 and a fourth dot 1008 adjacentto the third dot 1006. The third dot 1006 is separated from the fourthdot 1008 by a first distance 1014 that is the same as, or substantiallysimilar to, the first distance 1012. Also, the first dot 1002 isadjacent to the third dot 1006 and separated from the third dot 1006 bya third distance 1016 that is the same as, or substantially similar to,the first distance 1012. The second dot 1004 is adjacent to the fourthdot 1008 and separated from the fourth dot 1008 by a fourth distance1018 that is the same as, or substantially similar to, the firstdistance 1012.

The flat object 1020, having no change or variance in depth, allows forthe equidistant spacing of the dots of the dot pattern 1000 (describedabove). In this regard, an electronic device (not shown) that includes avision system having a light emitting module previously described mayuse the equidistant spacing of the dots to determine the flat object1020 is flat. However, when the object is not flat, the dots of the dotpattern 1000 may no longer be spaced equidistantly apart.

FIGS. 26 and 27 illustrate an electronic device that includes a visionsystem having features for a vision system described herein. This visionsystem can be used to provide object recognition, including facialrecognition, of a three-dimensional object using information provided bya dot pattern having several sets of adjacent dots that are spaced apartat different distances as compared to other sets of adjacent dots.

FIG. 26 illustrates a side view of an electronic device 1100 using avision system 1110 to determine dimensional information of a user 1114,in accordance with some described embodiments. The electronic device1100 and the vision system 1110 may include any features describedherein for an electronic device and a vision system, respectively.Accordingly, the vision system 1110 may include a light emitting module(not shown) designed to emit light rays 1112 in accordance with a dotpattern, such as the dot pattern 1000 (shown in FIG. 25). However, whenthe light rays 1112 are directed to an object having features withdifferent depths (corresponding to different distances from theelectronic device 1100), some of the light rays 1112 will reach the user1114 before others. As a result, the light rays 1112 may project a dotpattern onto the user 1114 in which the dots are not spacedequidistantly apart. This will be shown and described below. As commonlyknown, a face of the user 1114 may include various features—eyes, ears,nose, lips, etc. —that can define different depths of the user 1114, andaccordingly, different distances from the electronic device 1100. Forexample, two adjacent light rays may project adjacent dots onto a nose1118 of the user 1114 that are closer together than two adjacent lightrays that project adjacent dots onto an ear 1122 of the user 1114. Thearrangement of the dots can form a dot pattern that represents a uniqueprofile stored on the electronic device 1100, and subsequently used bythe electronic device 1100 to recognize the user 1114 in order toprovide a user authentication, as a non-limiting example. Also, thelight rays 1112 shown in FIG. 26 may represent a fraction of the totallight rays. In other words, a light emitting module described herein mayemit more lights rays than what is shown in FIG. 26.

FIG. 27 illustrates a plan view of a dot pattern 1130 projected onto animage 1140 of the user 1114, showing various spatial relationships ofdots of the dot pattern 1130 with respect to each other. It should benoted that the dot pattern 1130 projected onto the user 1114 is theresult of the light rays 1112 emitted from the electronic device 1100(shown in FIG. 26). The image 1140 shown in FIG. 27 may be an imagecaptured and produced by a first camera module described herein of thevision system 1110 of the electronic device 1100 (shown in FIG. 26). Asshown, the image 1140 may include a two-dimensional profile (in the X-Yplane) of the user 1114 with the dot pattern 1130 projected onto theimage 1140 of the user 1114. Based on the dot pattern 1130, thetwo-dimensional profile of the user 1114 can be used by the electronicdevice 1100 to create a depth map.

Due in part to the user 1114 having various facial features thatrepresent different depths, or distances from the electronic device 1100(shown in FIG. 26), the dot pattern 1130 may include adjacent dots thatare spaced apart in manner different than other dots. In other words,the pitch between adjacent dots varies when the dot pattern 1130 isprojected onto the user 1114 (or another other object that includesthree-dimensional features). For example, the dot pattern 1130 mayinclude a first dot 1132 and a second dot 1134 adjacent to the first dot1132, with the first dot 1132 and the second dot 1134 projected onto theear 1122 and separated by a distance 1136. The dot pattern 1130 mayfurther include a third dot 1142 and a fourth dot 1144 adjacent to thethird dot 1142, with the third dot 1142 and the fourth dot 1144projected onto the nose 1118 and separated by a distance (not labeled)that is less than the distance 1136 between the first dot 1132 and thesecond dot 1134. As a result, the electronic device 1100 (shown in FIG.26) can compare spacing between adjacent dots projected onto onefeature, such as the nose 1118, as well as adjacent dots projected ontoanother feature, such as the ear 1122, use the comparison to determineone feature is closer than another feature. Also, the location of theadjacent dots, and their associated spacing, can be stored by theelectronic device 1100 (using memory), which can further be used todetermine the user 1114.

The electronic device 1100 (shown in FIG. 26) can retrieve and processthe spacing or distance between all adjacent dots in the dot pattern1130, and determine several additional features of the user 1114. Theimage 1140, in conjunction with the spacing information of adjacent dotsof the dot pattern 1130 projected onto the image 1140, can be used tobuild a unique profile of the user 1114. The electronic device 1100(shown in FIG. 26) may compare the profile against a known or preset(reference) profile of the user 1114, and determine whether the user1114 is carrying the electronic device 1100. If a sufficient matchbetween the captured profile of the user 1114 and the reference profileof the user 1114 is determined, the electronic device 1100 may use thematch as a virtual password and the unlock the electronic device 1100,which may include switching on a display assembly (such as the displayassembly 716 shown in FIG. 13) from a locked screen to an unlockedscreen thereby granting the user 1114 access to the various features andcontents of the electronic device 1100. While the object shown anddescribed in FIGS. 26 and 27 shows a face of the user 1114, theelectronic device 1100 may provide object recognition of otherthree-dimensional objects other than the user 1114 of the electronicdevice 1100, such as inorganic objects.

FIG. 28 illustrates a schematic diagram of an electronic device 1200.The electronic device 1200 may be representative of other embodiments ofelectronic devices described herein. The electronic device 1200 mayinclude storage 1202. The storage 1202 may include one or more differenttypes of storage such as hard disk drive storage, nonvolatile memory(such as flash memory or other electrically-programmable read-onlymemory), volatile memory (such as battery-based static or dynamicrandom-access memory).

The electronic device 1200 may include processor circuitry 1206 havingone or more processors that communicate with several peripheral devicesvia a bus system 1204. The processor circuitry 1206 may be used tocontrol the operation of the electronic device 1200, and may include aprocessor (such as a microprocessor) and other suitable integratedcircuits. In some embodiments, the processor circuitry 1206 and thestorage 1202 run software on the electronic device 1200. For example,the software may include object recognition software. In this regard,the electronic device 1200 may include output devices 1208 and inputdevices 1210 that supply data to the electronic device 1200, and alsoallow data to be provided from the electronic device 1200 to externaldevices. The output devices 1208 may include a light emitting module ofa vision system designed to project a light pattern (such as a dotpattern) onto an object, and is used in conjunction with the objectrecognition software. The output devices 1208 may further include alighting element used during low-light (dim) applications. Additionally,the output devices 1208 may include a display layer (associated with adisplay assembly) and an audio module.

The input devices 1210 may include multiple camera modules. Forinstances, one of the camera modules can be used to capture an image andis used in conjunction with the object recognition software. Anothercamera module can be used to receive the light pattern from the lightemitting module. Using the object recognition software, the lightpattern can be superimposed onto the captured image and the electronicdevice 1200 can determine what the object is. For example, the objectrecognition software can be used for facial recognition. The objectrecognition software can use the camera modules and light emittingmodule to provide an initial scan of the object, and can store theinitial scan as a profile on the storage 1202. The initial scan may bereferred to as a reference image or reference scan. Then, the objectrecognition software can be used to scan a subsequent object and createa profile of the subsequent object to determine whether the subsequentobject matches the initially stored profile on the storage 1202. The“match” between the reference image and a subsequent image may be basedupon a software or algorithm on the storage 1202 that requires acomparison (between the reference image and the subsequent image) tomeet or exceed a threshold match. For example, if a comparison betweenthe reference image and a subsequently captured image is 75 percent orgreater, a “match” is determined. The percent match setting can beadjusted (higher or lower) if necessary. The processor circuitry 1206can determine whether the match is made. The processor circuitry 1206may signal the electronic device 1200 to unlock, thereby allowing a userto interact with the electronic device 1200. Otherwise, if a comparisonbetween the reference image and the subsequent image does not meet orexceed threshold match (as determined by the processor circuitry 1206),the processor circuitry 1206 may signal the display of the electronicdevice to display a fail message, or signal to the user that permissionto use the electronic device is not granted. Additionally, the inputdevices 1210 may include buttons, switches, touch input and force touchlayers (associated with a display assembly). Also, the electronic device1200 may include a power supply (such as a battery) that provideselectrical energy to the storage 1202, the processor circuitry 1206, theoutput devices 1208, and the input devices 1210.

While some vision systems described herein are generally located at ornear an uppermost portion of an electronic device, FIGS. 29 and 30 showelectronic devices that include a vision system with modules positionedat different locations throughout an electronic device. Although notshown, the electronic devices in FIGS. 29 and 30 may include anyfeatures described herein for an electronic device, a vision system, anda bracket assembly.

FIG. 29 illustrates a plan view of an alternate embodiment of anelectronic device 1300 that includes a vision system 1310 held by abracket assembly 1340, in accordance with some described embodiments.The vision system 1310 is designed to provide recognition of an object,which may include facial recognition of a user of the electronic device1300. The vision system 1310 may include a first camera module 1312designed to capture an image of the object. The vision system 1310 mayfurther include a light emitting module 1314 is designed to generatelight rays that are projected onto the object into the form of lightrays. The vision system 1310 may further include a second camera module1316 is designed to receive the dot pattern that is projected onto theobject. As shown, the bracket assembly 1340 may space the modules of thevision system according to a triangular arrangement. However, otherpossible arrangements are possible. The bracket assembly 1340 maymaintain separation, by a predetermined distance, between the firstcamera module 1312 and the light emitting module 1314, the lightemitting module 1314 and the second camera module 1316, and the firstcamera module 1312 and the second camera module 1316. A transparentcover and display assembly (both not shown in FIG. 29) of the electronicdevice 1300 may be modified in order to allow the first camera module1312, the light emitting module 1314, and the second camera module 1316to function in a manner that provides the object recognition. This mayinclude removal or realignment of the display assembly, as an example.

FIG. 30 illustrates a plan view of an alternate embodiment of anelectronic device 1400 that includes a vision system 1410 held by abracket assembly 1440, in accordance with some described embodiments.The vision system 1410 is designed to provide recognition of an object,which may include facial recognition of a user of the electronic device1400. The vision system 1410 may include a first camera module 1412designed to capture an image of the object. The vision system 1410 mayfurther include a light emitting module 1414 is designed to generatelight rays that are projected onto the object into the form of lightrays. The vision system 1410 may further include a second camera module1416 is designed to receive the dot pattern that is projected onto theobject. As shown, the bracket assembly 1440 may space the modules of thevision system according to a triangular arrangement. However, otherpossible arrangements are possible. The bracket assembly 1440 maymaintain separation, by a predetermined distance, between the firstcamera module 1412 and the light emitting module 1414, the lightemitting module 1414 and the second camera module 1416, and the firstcamera module 1412 and the second camera module 1416. Further, as shown,the bracket assembly 1440 may position the aforementioned modules incorners of the electronic device 1400. A transparent cover and displayassembly (both not shown in FIG. 30) of the electronic device 1400 maybe modified in order to allow the first camera module 1412, the lightemitting module 1414, and the second camera module 1416 to function in amanner that provides the object recognition. This may include removal orrealignment of the display assembly, as an example. However, due in partto the modules being positioned in the corners, the amount of removal orrealignment of the display assembly may be limited.

FIG. 31 illustrates a flowchart 1500 describing a method for assemblinga vision system for recognition of an object, in accordance with somedescribed embodiments. The flowchart 1500 may describe a vision systemused for facial recognition. In step 1502, a first camera module carriedwith a bracket assembly. The first camera module is configured tocapture an image of an object. Also, the bracket assembly may includemultiple brackets pieces, such as a first bracket and a second bracket.

In step 1504, a first camera module is secured with the bracketassembly. The first camera module is configured to capture an image ofthe object. The first camera module may capture visible light reflectedfrom the object.

In step 1506, a light emitting module is secured with the bracketassembly. The light emitting module is configured to emit light thatprojects a dot pattern onto the object. The light emitting module mayemit IR light. Further, the light emitting module may emit lights raysin accordance with a dot pattern of light.

In step 1508, a second camera module is secured with the bracketassembly. The second camera module can be carried by the bracketassembly. Also, the second camera module is configured to capture thedot pattern projected onto the object. For example, the second cameramodule may capture a reflected portion of the dot pattern projected ontothe object. In this manner, a processor that receives the image and thereflected portion of the dot pattern can provide recognition of theobject. The second camera may include a filter designed to receive onlylight generated by the light emitting module, or at least light in thefrequency range of light generated by the light emitting module.Further, the dot pattern, which can be formed by light rays, may includeseveral adjacent dots that are separated by distances that are differentthan distances of other adjacent dots. The object can be determined bythe image, in conjunction with the light rays received by the secondcamera module. Further, the bracket assembly may provide structuralrigidity such that any movement of the bracket assembly corresponds tothe same amount of movement of the modules, so as to prevent relativemovement of the modules.

The various aspects, embodiments, implementations or features of thedescribed embodiments can be used separately or in any combination.Various aspects of the described embodiments can be implemented bysoftware, hardware or a combination of hardware and software. Thedescribed embodiments can also be embodied as computer readable code ona computer readable medium for controlling manufacturing operations oras computer readable code on a computer readable medium for controllinga manufacturing line. The computer readable medium is any data storagedevice that can store data, which can thereafter be read by a computersystem. Examples of the computer readable medium include read-onlymemory, random-access memory, CD-ROMs, HDDs, DVDs, magnetic tape, andoptical data storage devices. The computer readable medium can also bedistributed over network-coupled computer systems so that the computerreadable code is stored and executed in a distributed fashion.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic device, comprising: a housing atleast partially defining an internal volume; a display assemblyincluding a touch input layer, the display assembly comprising a notchthat defines an inactive area of the display assembly; and a facialrecognition system, comprising: an emitter configured to project apattern onto a surface; a sensor configured to detect the pattern on thesurface; and processor circuitry configured to authenticate a user basedat least in part on the detected pattern.
 2. The electronic device ofclaim 1, wherein the emitter and the sensor are disposed at the notch.3. The electronic device of claim 1, wherein the notch defines aninactive area along a top edge of the display assembly.
 4. Theelectronic device of claim 1, wherein the surface is a body part of theuser.
 5. The electronic device of claim 1, wherein the processorcircuitry is configured to unlock the device based at least in part onthe authenticating the user.
 6. The electronic device of claim 1,wherein the pattern projected by the emitter comprises spaced apartdots.
 7. The electronic device of claim 6, wherein the sensor isconfigured to determine a variation in a separation distance between oneor more dots of the detected pattern.
 8. The electronic device of claim7, wherein the variation corresponds to structural features of thesurface.
 9. The electronic device of claim 7, wherein the processorcircuitry is configured to authenticate the user based at least in parton a comparison between the determined variation in the separationdistance and a reference profile.
 10. The electronic device of claim 1,further comprising a doppler module configured to detect motion.
 11. Theelectronic device of claim 1, wherein the doppler module is disposed atthe notch.
 12. An electronic device, comprising: a housing; atransparent cover coupled with the housing; a display assembly coveredby the transparent cover, the display assembly including a touch inputlayer and an active region; and an object recognition system covered bythe transparent cover and disposed adjacent to the active region, theobject recognition system comprising: an emitter configured to project apattern; a sensor configured to detect the pattern on a surface; andprocessor circuitry configured to perform an action based at least inpart on the detected pattern.
 13. The electronic device of claim 12,wherein the emitter comprises an infrared light emitter.
 14. Theelectronic device of claim 13, wherein the projected pattern comprises apattern of regularly spaced apart dots of infrared light.
 15. Theelectronic device of claim 12, wherein the sensor comprises a firstcamera module and a second camera module.
 16. The electronic device ofclaim 15, wherein the first camera module is configured to capture animage of the surface and the second camera module is configured toreceive light corresponding to the pattern on the surface.
 17. Theelectronic device of claim 16, wherein the surface is defined by auser's face
 18. The electronic device of claim 12, wherein the processorcircuitry is configured to determine a three-dimensional depth map ofthe surface based at least in part on the detected pattern.
 19. Theelectronic device of claim 18, wherein the processor circuitry isconfigured to compare the three-dimensional depth map with apredetermined reference profile and to perform the action when thethree-dimensional depth map corresponds to the predetermined referenceprofile.
 20. An electronic device, comprising: a housing at leastpartially defining an internal volume; a display assembly including atouch input layer and an inactive area; and an object recognitionsystem, comprising: an emitter configured to project a pattern onto asurface; a sensor configured to detect the pattern on the surface; andprocessor circuitry configured to identify the object based at least inpart on the detected pattern.
 21. The electronic device of claim 20,wherein the processor circuitry is configured to detect motion of thesurface.
 22. The electronic device of claim 20, wherein the processorcircuitry is configured to determine a spatial relationship betweenfeatures of the object.
 23. The electronic device of claim 20, whereinthe surface is defined by multiple objects.
 24. The electronic device ofclaim 23, wherein the processor circuitry is configured to determinespatial relationships between the multiple objects.
 25. The electronicdevice of claim 20, wherein the sensor comprises two or more cameramodules.
 26. The electronic device of claim 20, wherein the emittercomprises a pattern emitting module and a flood module.